The University of Texas at Austin is participating in a US DARPA (Defense Advanced Research Projects Agency) research project aimed at the additive manufacturing of non-planar microsystems. As part of the AMME (Additive Manufacturing of MicrosystEms) program, the company Electroninks was selected as the exclusive material supplier. Electroninks produces organometallic inks that have been specifically developed for use in high-precision 3D printing processes.
The AMME program aims to establish new manufacturing processes that combine conductive and insulating materials in a single additive process. The aim is to create complex, miniaturized structures that cannot be realized using conventional processes. The focus is on a high-resolution, multi-material printing technology that enables faster, more efficient and more flexible integration of components – especially for applications in semiconductors, AI hardware and communication systems.
“AMME represents a significant step forward in semiconductor technology, addressing critical challenges in AI hardware and advanced packaging,” said Professor Michael Cullinan. “By integrating cutting-edge materials with state-of-the-art holographic lithography, we aim to drive new levels of efficiency and capability in semiconductor manufacturing.”
As part of the project, Electroninks is supplying conductive inks that are tailored to fast lithographic processes. These materials should make it possible to realize 3D interconnects with lower conduction losses and more compact packaging.
“We are obviously poised to be a significant partner for this consortium and play a key role in fulfilling DARPA’s goals,” stated Brett Walker, PhD, co-founder and CEO of Electroninks. “This is great news for the State of Texas, innovation and the future of technology.”
Electroninks’ material developments promise not only greater depth of integration, but also shortened production times. 3D printing allows semiconductor components to be packed more densely, which shortens signal paths and thus minimizes energy losses. For DARPA, this project represents a strategic contribution to the further development of US semiconductor manufacturing – with potential applications in both the civilian and security sectors.
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