Home Industry 3T and Hittech establish joint venture for 3D printing in the semiconductor...

3T and Hittech establish joint venture for 3D printing in the semiconductor industry

The companies 3T Additive Manufacturing and Hittech Group have announced a partnership for 3D printing in the semiconductor market. According to a press release, the companies want to combine their expertise in a joint venture in order to offer new products.

3T specializes in metal 3D printing and is active in the aviation industry, for example. The Hittech Group consists of several precision manufacturing and assembly companies.

Together, the two partners now want to build a kind of ecosystem for industrial manufacturing – from the idea to smart production. The focus is on the semiconductor industry. According to the press release, the companies’ values and professionalism are a good match.

Both 3T and Hittech emphasize that sustainability is important to them. According to 3T CEO Dan Johns, this will enable them to make a contribution to decarbonization in manufacturing. By pooling their expertise, the partners want to offer manufacturers in the semiconductor industry a comprehensive solution.

According to the announcement, the exact location of the planned joint venture is still open. Germany and the Netherlands are therefore in the running. 3T and Hittech see great potential in the cooperation to further advance additive manufacturing in the industry.

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