The use of additive manufacturing in electronics is opening up new possibilities for design, functionality, and production processes. The Electronics & Components forum at rapid.tech3D on May 14, 2025, will focus on the industrial maturity of these technologies. For the first time, a dedicated session will address this topic. The forum’s partner is 3-D MID e. V., a research association dedicated to the development of mechatronic integrated devices.
Additive manufacturing of electronic components includes a variety of technologies, such as the 3D printing of coil bodies, the production of dielectric materials for high-frequency applications, and printed photovoltaics.
“In recent years, many innovations have emerged in the field of 3D-printed electronics, and we are now seeing approaches reaching application maturity. This goes beyond printed structures and extends to complete components such as chips, sensors, LEDs, or microprocessors. We aim to present these developments to the audience in Erfurt and discuss the next steps together,” says Wolfgang Mildner, CEO of consulting and technology company MSWtech and a member of the rapid.tech 3D advisory board. “We have been in close contact with the research association for many years. Now, we have taken this collaboration to a new level.”
A key topic of the forum is additive manufacturing for mechatronic systems (Additive Mechatronics). This technology combines mechanical, electrical, and thermal functions within components, offering advantages such as miniaturization and functional integration. Prof. Dr. Florian Risch, managing director of 3-D MID e. V., will provide an overview of current developments and application fields.
Other focal points include metal and polymer 3D printing in electrical engineering as well as innovative materials for high-frequency applications. Maximilian Ruoff from Weisser Spulenkörper and Dr. Johannes Lohn from PROTIQ will discuss the processing of copper and flame-retardant materials in 3D printing. Guillaume de Calan, CEO of Nanoe, will present new ceramic materials for high-frequency components.
Another major topic is the integration of additively manufactured photovoltaics into various application areas. Dr. Jens Hauch from the Helmholtz Institute Erlangen-Nuremberg will showcase how emerging PV technologies can be printed onto flexible substrates and utilized in IoT applications. Additionally, Khasha Ghaffarzadeh, CEO of TechBlick, will provide an overview of current innovations in additive electronics.
In addition to expert presentations, rapid.tech3D will offer deep dive sessions, expert tables, and exhibitor demonstrations. Running in parallel, the Quantum Photonics event will explore the intersections between additive manufacturing and quantum technology. The conference will highlight the increasing convergence of various technology fields and their industrial applications.
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