Home Industry FBH Showcases Additive Manufacturing Solutions and 3D-Printed Quantum Technology at Laser World...

FBH Showcases Additive Manufacturing Solutions and 3D-Printed Quantum Technology at Laser World of Photonics 2025

Picture: Bernhard Schurian, FBH/Schurian.com

The Ferdinand-Braun-Institut (FBH) will present its latest developments in diode lasers, quantum light sources, and additive manufacturing at Laser World of Photonics in Munich (June 24–27, 2025). The spotlight will be on application-specific laser systems and the use of 3D-printed technical ceramics for miniaturized quantum sensors. Exhibits and research findings will be featured at the Berlin-Brandenburg joint booth in Hall A2.117 and simultaneously at the World of Quantum in Hall A1.240.

In the field of additive manufacturing, FBH will demonstrate its direct diode laser system “Samba,” optimized for processing aluminum with kilowatt-level power. The prototype is being evaluated in real production environments by project partners such as Photon Laser Manufacturing and SKDK. Thanks to its high power density and beam quality, the system enables efficient melting in laser-based manufacturing processes. In addition, the institute will highlight advancements in single-mode lasers for space-based power-beaming applications, where energy is transmitted via electromagnetic radiation.

Another key focus is the 3D printing of technical ceramics for compact quantum technologies. Using a lithography-based process, structured aluminum oxide components with high mechanical stability can be manufactured. These serve as substrates for optical systems like frequency references based on rubidium laser spectroscopy. Through hybrid microintegration, compact modules with reduced volume and weight have been developed, making them suitable for mobile quantum sensing.

In parallel, FBH will also present the integration of photonic components based on GaAs. These include enhanced PIC platforms with ring resonator lasers and chiplets for silicon nitride waveguides. The findings contribute to the European APECS pilot line of the Research Fab Microelectronics, which is part of the EU Chips Act initiative to accelerate the transfer of technologies into industrial applications.


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