After three years of development work, Fiberthree is presenting its new F3 PA ESD filament at Formnext 2024, which has been specially developed for applications that require high mechanical stability and ESD protection.
The material is based on a carbon fiber-reinforced polyamide (PA-CF) and achieves a surface conductivity of 10⁵ to 10⁷ Ω/cm, which meets the requirements of the DIN EN 61340-5 standard. The special feature of this material is its uniform conductivity, both on horizontal and vertical planes – a distinguishing feature compared to other ESD filaments on the market.
The F3 PA ESD offers impressive mechanical properties with a tensile strength of 84 MPa in the X/Y direction and a modulus of elasticity of 8 GPa. The layer adhesion along the Z-axis is 32 MPa, which makes it comparable to other Fiberthree materials in terms of strength. These values illustrate the material’s high load-bearing capacity and its suitability for technical applications where reliable ESD properties are required.
The filament is a combination of carbon fiber-reinforced polyamide and conductive elements such as carbon nanotubes, graphite or carbon black, which provide the desired conductivity. These properties are achieved independently of printing parameters such as nozzle diameter and layer thickness and can be used for standard FFF printers. Fiberthree plans to offer another conductive polyamide filament soon, which will achieve a conductivity of 10² Ω/cm to 10⁴ Ω/cm and enable the printing of conductive tracks for sensors.
The F3 PA ESD is available in diameters of 1.75 mm and 2.85 mm and in spool sizes of 500 g, 1000 g and 2000 g. It is supplied pre-dried and is ready to use for various desktop printers such as Prusa, Raise3D, Ultimaker and Bambu as well as for industrial machines.
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