
The Chinese manufacturer Intamsys is expanding its portfolio of high-temperature 3D printers with the Funmat Pro 310 Apollo. The FFF system is aimed at users who want to produce parts made from PAEK materials such as PEEK or PEKK not only as prototypes, but also in small series and in continuous operation. The focus is on reproducible mechanical properties and process-reliable handling of the sensitive high-performance polymers.
The Funmat Pro 310 Apollo works with independently operating dual extruders (IDEX). The build volume is 305 × 260 × 260 mm in single-print mode and 260 × 260 × 260 mm in dual mode. The nozzle reaches up to 450 °C, the heated print bed up to 160 °C, and the enclosed build chamber up to 100 °C. Supported layer heights range between 0.1 and 0.3 mm, with a maximum travel speed of 500 mm/s; for PAEK materials, the manufacturer recommends significantly lower printing speeds of up to around 200 mm/s. This clearly positions the machine for production-oriented environments with longer print jobs.
In addition to PEEK and PEKK variants, the material portfolio also includes PPS, PPA and PA types as well as glass- and carbon-fiber-reinforced filaments. An integrated drying chamber holds spools of up to 3 kg, monitors temperature and humidity, and can be heated to up to 65 °C. Intamsys emphasizes that this enables constant environmental conditions for multi-day print jobs and improved Z-bonding, including tensile strengths of over 40 MPa for PAEK parts.
The printer is controlled via the in-house Intamsuite Neo slicer software, which is designed to coordinate temperature control, material flow, and motion profiles. Features such as remote monitoring, OTA updates, and process data logging are aimed in particular at quality assurance and maintenance in industrial environments. Safety features including interlocked doors, over-temperature and overload protection, as well as HEPA and activated carbon filters target use in laboratories and shop floors.
With the Funmat Pro 310 Apollo, Intamsys is positioning itself for users who want to scale from PEEK prototypes to PAEK end-use parts without fundamentally changing their process chain. For companies with a regular need for temperature-resistant functional components, the system can represent an alternative to smaller FFF printers or external manufacturing service providers.
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