Home Industry New connection technology for microelectronics presented

New connection technology for microelectronics presented

With TriChipLink, DUJUD has developed a new technology that makes it possible to integrate several silicon microdevices in a 3D microsystem. This is based on proprietary manufacturing and 3D interconnect technologies that overcome conventional limitations in microelectronics.

TriChipLink connects various microdevices, from MEMS (Micro-Electro-Mechanical Systems) to microcontrollers and sensors, in a non-planar arrangement and promises significant advantages over existing interconnection methods.

In modern microelectronics, especially in system-in-package (SiP) solutions, traditional interconnection technologies such as wire bonding and flip-chip bonding are reaching their limits. Wire bonds are known for high electrical losses due to inductive parasitics, while flip-chip connections often fail due to mechanical weaknesses, especially in heat-intensive applications. TriChipLink avoids these problems by using innovative 3D microstructures that reduce both electrical losses and mechanical stresses.

“Over the past 30 years, numerous technologies have been developed to overcome the limitations of constrained 2D silicon real estate. While 3D microsystems promise the highest density of integration, they face fundamental challenges such as manufacturability and reliability. TriChipLink addresses many of these long-standing issues,” said Dr. Reza Abbaspour, CEO of DUJUD.

The 3D connections in TriChipLink are characterized by shorter electrical lengths, which reduces losses by at least 30 percent. At the same time, the mechanically flexible microstructures offer greater resilience to thermal stresses caused by temperature fluctuations.

“Wire bonds are notorious for poor high-frequency performance due to their inductive parasitics, which result from their extended physical lengths. Meanwhile, flip-chip-bonded solder bumps are highly unreliable in heat dissipating microchips. Our proprietary 3D interconnection technology, a key component of TriChipLink, resolves both issues,” said Dr. Abbaspour.

TriChipLink utilizes a proprietary 3D microfabrication technology that enables the additive manufacturing of microdevices and their interconnection. The technology achieves three times higher resolution and 20 times faster production compared to traditional methods such as inkjet or aerosol 3D printing. This makes TriChipLink not only more efficient, but also more suitable for sensitive semiconductors that often have problems with thermal processes such as thermocompression bonding.

“We have developed a manufacturing process for additively building 3D electronic microdevices. This key capability has allowed us to invent a solderless assembly and bonding process that interconnects multiple chips in a 3D SiP without requiring thermo-compression. For sensitive semiconductor devices prone to thermal drifts during thermo-compression bonding, TriChipLink provides an effective solution to prevent characteristic drifts,” added Dr. Abbaspour.

With TriChipLink, DUJUD offers a promising alternative to conventional interconnection methods in microelectronics and lays the foundation for more powerful and reliable 3D microsystems.


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