Nikon optimizes X-ray CT systems for the inspection of additively manufactured electronic components

Nikon has introduced a series of hardware and software upgrades for its XT-V series X-ray CT systems. The systems are widely used in electronics manufacturing and are increasingly being employed for quality assurance of components produced by 3D printing. With these enhancements, Nikon addresses typical challenges in the non-destructive inspection of complex printed circuit boards, assemblies, and additively manufactured components.

At the core on the software side is the High Contrast Filter 2.0. It is designed to deliver consistent image quality regardless of the geometry and density distribution of the sample. For users in additive manufacturing, this is relevant because inhomogeneous density distributions, porosities, and incompletely fused regions can be hidden within a single 3D-printed component. Stable contrast makes it easier to detect shrinkage cavities, delaminations, or defects at an early stage and to optimize process parameters in a targeted manner.

On the hardware side, Nikon is expanding the XT-V platform with several options. A reinforced sample holder allows the loading of heavier components and entire assemblies, such as those produced by metal powder bed fusion or multi-material 3D printers. A diamond window at the beam exit is intended to improve image contrast across the entire energy and magnification range, especially for lightweight or multi-material samples. A low-dose collimator reduces the dose for radiation-sensitive electronics so that semiconductor structures or fine SMD components within larger batches can also be inspected without impairing their functionality.

For ESD-critical environments, Nikon offers an upgrade that supports inspections in ESD-protected areas in accordance with IEC 61000-4-2, ANSI/ESD S20.20, and JEDEC JESD625. A CT arm with higher magnification is designed to image very small components at higher resolution, which is particularly interesting for microstructures on 3D-printed substrates.

This positions Nikon’s XT-V series more strongly as a tool along the entire process chain: from conventional electronics manufacturing and additively manufactured prototypes through to serial inspection of 3D-printed functional parts. Manufacturers can use the same inspection platform to secure design approvals, monitor production processes, and analyze returned parts – without having to destroy components.