Home Industry RAYLASE presents AM-MODULE NEXT GEN at LANE Conference

RAYLASE presents AM-MODULE NEXT GEN at LANE Conference

RAYLASE GmbH is attending this year’s LANE CONFERENCE in Fürth (Bavaria), where it will welcome visitors to its own stand.

From 3 to 6 September 2018, you will have the opportunity to chat with product manager Wolfgang Lehmann at the stand and gain an overview of the laser solutions that are possible with RAYLASE technology.

We will also present the following hardware at our stand and will be happy to provide trade visitors to the LANE CONFERENCE with all the information they need about the various application scenarios:


The AM-MODULE NEXT GEN for fiber-coupled lasers features homogeneous power density and exceptionally low drift values. It enables ultradynamic, rapid processing with flexible spot diameters. Full digital, model-based control is ensured with absolute precision.

SUPERSCAN IV-15 (with wafer tuning)

To enable the high-quality yet time- and cost-efficient production of powerful wafers, RAYLASE optimized the SUPERSCAN IV-15 specifically with these applications in mind, as they require the highest possible positioning speed. One example of a trend-setting application is the manufacturing of photovoltaic wafers using the PERC technique. The SUPERSCAN IV-15 WAFER’s model-based digital control offers maximum speeds of up to 200 rad/s.


And, thanks to the .NET programming environment and extensive program library, even the most complex applications can be implemented quickly with this control card.

The RAYLASE team is looking forward to having lots of interesting conversations and encountering some new and inspiring challenges at the LANE CONFERENCE 2018.

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