The semiconductor industry is increasingly relying on additive manufacturing processes to minimize waste and reduce production costs. TRUMPF will be presenting new solutions for this area at Formnext.
The advantages of additive manufacturing are particularly evident in liquid and gas distributors. The conventional production of these components often results in heavy components with unfavorable flow properties. “AM technology allows manufacturers of semiconductor equipment to combine several parts into one, which improves reliability,” explains Marco Andreetta, who is responsible for additive 3D printing production in the semiconductor sector at TRUMPF.
The new generation of automatic multi-laser alignment (AMA) plays a central role in this. The system monitors and corrects the position of the laser beams during the printing process in the micrometer range. The second version works faster and more precisely than its predecessor.
Another core element is the real-time monitoring of the melt pool. This technology can eliminate the need for time-consuming follow-up checks such as computer tomography scans. Quality control takes place directly during the printing process.
The additively manufactured components impress with their higher rigidity and lower weight. At the same time, they reduce pressure losses and flow-induced vibrations. These properties are crucial for semiconductor production in the nanometer range, as even the smallest deviations can lead to faulty chips.
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