Fonon Corporation, a specialist in subtractive and additive manufacturing, introduces its 3D laser cutting systems for the glass industry.
The patented 3D Zero Width Laser Cutting Technology (ZWLCT) enables glass materials up to a thickness of 1.0 mm to be processed efficiently and precisely. This process differs fundamentally from traditional mechanical scribing methods and offers significant advantages in terms of speed, precision and material integrity.
ZWLCT works at a molecular level, creating microscopic cracks at a controlled depth and angle, resulting in an exceptional surface finish without cracking or chipping. Unlike conventional methods, this process does not cause surface damage or yield loss due to particle damage. Another advantage of this technology is its adaptability to variations in glass thickness during production.
Demand for these systems continues to grow as new flat panel display, semiconductor and electronics manufacturing facilities emerge worldwide to support market growth and cost reduction initiatives. Fonon’s ZWLCT technology not only provides improved separation and overall substrate quality, but also enables the processing of unlimited component sizes up to Gen-10 and beyond.
Another significant benefit of ZWLCT technology is the increase in material thickness, which leads to a reduction in production and handling damage in the factory, while also reducing premature failures in the field due to impacts. This results in an increase in speed, strength and quality as well as a reduction in manufacturing waste, which ultimately leads to a reduction in production time and costs. Therefore, this technology is becoming increasingly important in areas such as flat panel display, semiconductor and electronics manufacturing.
In summary, Fonon’s ZWLCT technology represents a significant advance in glass processing and related industries. It offers efficient, precise and gentle processing that is invaluable in modern manufacturing technology.