3D Systems and Oerlikon collaborate on Scaling and Accelerating Additive Metal Manufacturing

3D Systems and Oerlikon AM announced a collaboration agreement to further scale metal additive manufacturing. Combining both companies’ extensive process and application expertise with 3D Systems’ Direct Metal Printing platform and Oerlikon AM’s surface engineering capabilities will enable faster time-to-market for applications in highly critical industries such as semiconductors and aerospace.

Under the agreement, Oerlikon AM is acquiring 3D Systems’ fourth DMP Factory 500 system, the first that Oerlikon AM is adding in the U.S., to integrate into the manufacturing workflow at its North Carolina facility. This will help expand Oerlikon’s end-to-end supply chain solution for high-precision, complex aluminum components for the U.S. market.

3D Systems’ Application Innovation Group (AIG) has collaborated with Oerlikon AM’s Application Engineering to develop this solution. Both teams not only have deep expertise in additive manufacturing, but also in high-value applications across a variety of industries. Their combined experience with laser powder bed fusion and material and process qualification is invaluable for producing highly critical parts with lower lifecycle costs.

3D Systems’ industry-leading Direct Metal Printing (DMP) technology and Oerlikon’s AM production and surface development capabilities will result in a validated, certified production process for Oerlikon’s customers. This workflow includes the DMP Factory 500, an industry-leading platform with a vacuum chamber that ensures the lowest O2 content and a 3-laser configuration for the production of seamless large parts up to 500 mm x 500 mm x 500 mm. The result is the highest surface quality for 3D printed metal parts with excellent material properties.

“The adoption of Additive Manufacturing technology for series production occurs at an ever-increasing pace. For our customers to remain competitive in core technology markets (including semicon and aerospace), scale up to series production is dependent upon the successful execution of application development, qualification, and timely ramp up to full-scale production,” stated Jonathan Cornelus, business development manager, Oerlikon AM. “With Oerlikon and 3DSystems joining forces, this partnership will accelerate the industrialization of metal AM through an integrated team approach between the customer, printer OEM, and manufacturing partner. The efficiency gains will maximize the benefits of additive manufacturing across design, materials, printing, and post-processing to break performance barriers in the manufacturing supply chain.”

“Industries such as aerospace and semiconductor manufacturing require precision without compromise,” said Scott Green, solutions leader, 3D Systems. “Companies focusing on these areas require constant innovation to meet the accuracy, speed, reliability, and productivity demands of increasingly complex production. Bringing together the industry-leading technology and applications expertise of 3D Systems and Oerlikon AM is delivering increased quality, improved total cost of ownership, reduced time to market, and minimized supply chain disruption. I’m looking forward to seeing how our collaboration can amplify and accelerate the potential of metal AM.”

3D Systems and Oerlikon AM will both be attending SEMICON West, which will be held July 11-13, 2023, at the Moscone Center in San Francisco, California. Visitors interested in learning more about this solution can visit the companies at their respective booths – 3D Systems booth #260 and Oerlikon AM booth #5471.