Home 3D Printer Nano Dimension Files Patent For Multi-Material 3D Printing of Embedded Electronics

Nano Dimension Files Patent For Multi-Material 3D Printing of Embedded Electronics

Israel-based company Nano Dimension has recently received a budget of $ 1.13 million from the Israeli Office of the Chief Scientist at the Ministry of Economy to advance their Dragonfly 2020 PCB 3D printer. Today, the fully owned subsidiary Nano Dimension Technologies announced it has filed a patent application with the U.S. Patent and Trademark Office for the printing of 3D models, which includes electronic conductors.

The new patent covers a process developed by the company to 3D print objects containing conductive traces. Nano Dimension was able to make this new technological development as a result of its work developing materials and 3D printers for multilayer PCB prototyping.

The sintering of a printed metal conductor within a 3D printed polymer allows for complex connectors to be 3D printed and also makes it possible to 3D print moulded connectors directly onto electronic circuits. The newly developed process may also be applied to 3D printing of non-flat electronic circuits as well as structural objects with embedded electronic circuits in freeform designs that cannot be created using current circuit manufacturing technologies.

A similar device was launched by Harvard spin-off Voxel8 earlier this year. Their 3D electronics printing platform is capable of printing embedded electronics and was made available as developer kit.

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